The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections
نویسندگان
چکیده
The typical user environment load spectrum varies significantly between different electronic applications but changes in temperature are involved in nearly all of them. Owing to the increasing number of integrated high-performance functions, smartphones and handheld computers, for example, can experience significant changes in temperature during normal operation. The changes in temperature are typically caused either by internally generated heat dissipation or changes in the temperature of the environment. Today the maximum temperatures inside modern portable electronic products are in the range of 60-70 0C but occasionally they can even rise above 90 0C [1,2].
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